? semiconductor components industries, llc, 2016 february, 2018 ? rev. 1 1 publication order number: la6583mc/d la6583mc fan motor driver, btl driver single\phase full\wave monolithic linear ic overview the la6583mc is a low-saturation btl output linear driving motor driver for single-phase bipolar fan motors. it features quite, low power, high efficiency drive that suppresses ineffective current. it is optimal for use in applications that require miniaturization and low noise, such as cpu cooling fan motors and 5 to 12 v electronic game products. features ? single-phase full-wave linear drive with btl output (gain resistance 1 k ? 360 k ): most appropriate for consumer appliances power supply, namely equipment that requires silence because this has no switching noise ? low-voltage operation possible, with wide operable voltage range (2.8 to 13.8 v) ? low saturation output (upper + lower saturation voltages: v o sat (total) = 1.1 v typ, i o = 200 ma): high coil efficiency and small current drain. small heat generation from ic itself ? lock protection and auto return circuits built-in ? lock protection signal output (l during rotation, h at stop; open collector output) ? fg output (rotation speed detection output: open collector output) ? hall bias built-in (vhb = 1.3 v) ? heat protection circuit (design guarantee): when the large current flows because of output short-circuit, raising the ic chip temperature above 180 c, the heat protection circuit suppresses the drive current, preventing ic burn and breakdown ? compact and high heat capacity package www. onsemi.com mfp10sk case 751da marking diagram pin assignment xxxxxxxx ymddd xxxx = specific device code y = year m = month ddd = additional traceability data rd 10 fg 9 v cc 8 out2 7 gnd 6 in+ 1 hb 2 in ? 3 ct 4 out1 5 (top view) see detailed ordering and shipping information on page 5 of this data sheet. ordering information
la6583mc www. onsemi.com 2 specifications absolute maximum ratings (t a = 25 c) symbol parameter conditions ratings unit v cc max supply voltage 15 v i out max output current 0.8 a v out max output withstand voltage 15 v v rd/fg max rd/fg output withstand 15 v i rd/fg max rd/fg output current 5 ma i b max hb output current 10 ma p d max allowable dissipation mounted on a specified board (note 1) 800 mw t opr operating temperature (note 2) ? 30 to +100 c t stg storage temperature ? 55 to +150 c stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device function ality should not be assumed, damage may occur and reliability may be affected. 1. mounted on a specified board: 114.3 76.1 1.6 mm 3 , glass epoxy board. 2. t j = 150 c. use this ic within a range where the chip temperature does not exceed t j = 150 c during operation. caution: absolute maximum ratings represent the value which cannot be exceeded for any length of time. caution: even when the device is used within the range of absolute maximum ratings, as a result of continuous usage under high temperature, high current, high voltage, or drastic temperature change, the reliability of the ic may be degraded. please contact us for the further details. recommended operating conditions (t a = 25 c) symbol parameter conditions min typ max unit v cc supply voltage 2.8 ? 14.0 v v icm common-phase input voltage range of hall input 0 ? v cc ?1.5 v functional operation above the stresses listed in the recommended operating ranges is not implied. extended exposure to stresse s beyond the recommended operating ranges limits may affect device reliability. electrical characteristics (t a = 25 c, v cc = 12 v, unless otherwise specified) symbol parameter conditions min typ max unit i cc 1 circuit current during drive (ct = l) 4 6 9 ma i cc 2 at lock protection (ct = h) 2 4 6 ma ict1 lock detection capacitor charge current 2.0 2.8 3.5 a ict2 capacitor discharge current 0.15 0.23 0.30 a rct capacitor charge/discharge current ratio rct = ict1/ict2 9 12 15 ? vct1 ct charge voltage 1.6 1.7 1.8 v vct2 ct discharge voltage 0.6 0.7 0.8 v v ol out output l saturation voltage i o = 200 ma ? 0.2 0.3 v v oh out output h saturation voltage i o = 200 ma ? 0.9 1.2 v vhn hall input sensitivity zero peak value (including offset and hysteresis) ? 7 15 mv vrd/fg rd/fg output pin l voltage ird/fg = 5 ma ? 0.1 0.2 v ird/fgl rd/fg output pin leak current vrd/fg = 15 v ? 1 30 a
la6583mc www. onsemi.com 3 electrical characteristics (t a = 25 c, v cc = 12 v, unless otherwise specified) (continued) symbol unit max typ min conditions parameter vhb hb output voltage ihb = 5 ma 1.3 1.5 1.7 v tsd thermal protection circuit design target value (note 3) 150 180 210 c product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 3. this is a design guarantee value and no measurement with an independent unit is made. thermal protection circuit is built in this ic for the prevention of burnout of ic and thermal destruction. but, since the operation is outside the guarantee temperature range, therm al design must be made so that the thermal protection circuit is not activated during normal fan operation. truth table in ? in + ct out1 out2 fg rd mode h l l h l l l during rotation l h l h h ? ? h off off ? h lock protection note: ? : don?t care. figure 1. p d max ? t a ? 30 0 20 40 60 80 0 0.2 0.4 0.6 0.8 1.0 ambient temperature, t a ? c allowable power dissipation, p d ? w 100 ? 20 specified board: 114.3 76.1 1.6 mm 3 glass epoxy board.
la6583mc www. onsemi.com 4 block diagram figure 2. internal equivalent circuit diagram rd v cc fg out1 out2 gnd hb in+ in ? control circuit charge discharge discharge pulse ct = 0.47 to 1 f 1.5 v reg h
la6583mc www. onsemi.com 5 application circuit example figure 3. application circuit example hb di in+ in ? hb in+ in ? cr gnd v cc rd fg out1 out2 r2 *1 *2 *5 *4 *3 elements in substrate h r1 h la6583mc *1: when di to prevent breakdown in case of reverse connection is used, it is necessary to insert a capacitor cr to secure the regenerative current route. similarly, cr is necessary to enhance the reliability when there is no capacitor near the fan power line. *2: when the hall bias is taken from the hb pin, constant-voltage bias is made with about 1.3 v. therefore, the hall output becomes the stable amplitude voltage satisfactory in temperature characteristics. by inserting r2 to obtain the hall bias from both v cc and hb, as shown in the figure, heat generation of ic can be suppressed. *3: in this ic, the hall output amplitude is amplified to produce the drive waveform. therefore, the switching time of the current application direction is determined by the hall output, causing change in the characteristics of motor. if the hall element output amplitude is large, the start-up performance and efficiency of the ic are improved. on the other hand, if the hall element output amplitude is small, low-noise drive is ensured. adjust the hall element output amplitude by r1. *4: keep this open when this is not used. *5: when the wiring from the hall output to ic hall input is long, noise may be carried through the wiring. in this case, insert the capacitor as shown in the figure. ordering information device package wire bond shipping ? (qty / packing) la6583mc ? ah mfp10sk (225mil) au ? wire 1,000 / tape & reel la6583mc ? w ? ah mfp10sk (225mil) cu ? wire 1,000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d .
soic10w / mfp10sk (225 mil) case 751da issue a date 23 oct 2013 xxxxxxxx ymddd xxxx = specific device code y = year m = month ddd = additional traceability data generic marking diagram* *this information is generic. please refer to device data sheet for actual part marking. pb ? free indicator, ?g? or microdot ? ?, may or may not be present. soldering footprint* note: the measurements are not to guarantee but for reference only. (unit: mm) *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 1.0 5.60 0.47 1.0 mechanical case outline package dimensions http://onsemi.com 1 ? semiconductor components industries, llc, 2002 october, 2002 ? rev. 0 case outline number: xxx document number: status: new standard: description: 98aon80819e on semiconductor standard soic10w / mfp10sk (225 mil) electronic versions are uncontrolled except when accessed directly from the document repository. printed versions are uncontrolled except when stamped ?controlled copy? in red. page 1 of 2
document number: 98aon80819e page 2 of 2 issue revision date o released for production from sanyo enact # s ? 566 to on semiconductor. req. by d. truhitte. 31 may 2012 a add marking and solder footprint information. requested by darrell truhitte. 23 oct 2013 ? semiconductor components industries, llc, 2013 october, 2013 ? rev. a case outline number: 751da on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner.
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